应用领域: MEMS, photonics, nano technologies. 电子器件,医疗器件,航空航天.
设备特性: UV laser and CO2 laser micro machining.
·Uses excimer laser or DPSS laser with wavelengths ranging from 157nm to 355nm for various materials and geometric features.
·Large fiend of view (LFOV).
·Granite optical base, air bearing work stage.