应用领域: Wafer manufacturing (Si, GaAs等), IC fab, MEMS.
设备特性: Automated submicron slip detection systems.
·Epi, RTP, Diffusion, Annealing, SOI.
·Blank wafers, device patterned wafers, SOI wafers.
·Up to 300 mm wafer sizes.
·Manual models or high throughput automatic models.
